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    封裝品種

    WBBGAWBLGA Series

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    Production Overview

            TFME offers various WBBGA and WBLGA package based on customer different requirement.




    Features
    - 1.1x0.7 mm to 21x21 mm Package
    - 0.2mm to 1.0mm C Mold Chase
    - 01005 Components SMT
    - 0.3x0.3 mm Small Die 
    - 1-6 Layer Substrate


    Process Capability & Design Rule


    Reliability Test Standards



    Shipment Packing


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