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    封裝品種

    FCCSPFCLGA Series

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    Production Overview

            TFME offers various FCCSP and FCLGA package based on customer different requirement.



    Features
    - SiP (FC + SMT + Wire bond) available.
    - CUF, MUF available.
    - 7N/12N/14N/16N wafer node mass production
    - Various substrate technology qualified including SAP, MSAP, ETS, MIS and SLP.
    - Fully Turnkey for wafer bumping, probing, assembly, FT available.


    Process Capability & Design Rule


    Reliability Test Standards


    Shipment Packing


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