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    FCBGAFCLGA Series

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    Production Overview 
    Flip Chip interconnection, also knownas Controlled Collapse Chip Connection, C4, has been identified as a high performance packaging solution to meet the growing need for products with increased electrical performance, high I/O, and high system reliability as a replacement for conventional wire bond process. Utilizing whole die area as for electrical connection, substrate I/O per unit exponentially increased vs. perimeter wire interconnection technology. 
    Flip chip interconnect also allows direct connection with on-die power planes which enables increased electrical performance including increased switching speed and more efficient power distribution to the IC performance at lower operating voltages. 

    TF-AMD Flip Chip are assembled with single unit laminate which is the highest routing density through build-up technology to maximize the device performance &conventional ceramic substrate for reliability enhanced package solution. Combined with Flip Chip interconnection, TF-AMD provides optimal design flexibility for final package design& product format to fit an end user requirement. TF-AMD offers Flip Chip BGA packages with ball counts up to 3000 & PGA package up to 2000

    Application 
    Flip Chippackage is considered one of the most established industry platform applicable for high pincount and/or high performance ASICs. Large body FC BGA/PGAs provide package solution forComputing (microprocessors / graphic, server), gaming,high bandwidth networking/Communicationdevices. Combined with Flip Chip technology &BGA/PGAlead format, TF-AMD help to enable SMT and also pin insertion application.

    Features 
    Flip Chip BGA/PGA Packaging 
    Package Types: Bare die, Stiffener, Lidded (Top hat & flat top) 


    Wafer Node 314/16nm ELK(extreme low K) qualified, 7nm in development. 
    Package sizes from 12mm to 55mm (75mm in development) 
    Die area up to 800mm^2 

    Lead Free, Eutectic, High-Pb bump for Flip Chip connection 
    Passive component size down to 01005 
    High thermal performance solution using Indium metal TIM 


    Substrate 
                   o    4 – 18 layers laminate build up 
                   o    Coreless, 0.2mm, 0.4mm, 0.8mm, 1.0mm available 
                   o    High CTE ceramic / LTCC alumina ceramic 
                   o    BGA / PGA 


    Footprints Pitch 
                    o    BGA : 0.5mm, 0.65mm, 0.8mm and 1.0mm 
                    o    PGA : 1.0mm, 1.27mm 

    Other Option 
                    o    Multi-die capability 
                    o    Die binning to waffle pack up to 256 BINs 

    Flip Chip BGA/PGA Test 
    Test Product Engineering 
                    o    TF-AMD test provides a competitive test solution to our customers ranging from test development, platform conversion, and product maintenance and test data analysis. 
                    o    The team has rich test development experience of various product portfolio, including high-end digital, mix-signal, SOC and high speed products. 

    Adding Value to Customer 
                    o    Reduce customer overhead by outsourcing projects / tasks to avoid maintaining a large scale of dedicated team 
                    o    Incorporate industrial standard through leveraging best known method from our database & continuous cost saving by driving test time reduction, yield improvement 

    Service Solutions 
                     o    Wafer Sort test development 
                     o    Final Test development 
                     o    Low cost platform conversion 
                     o    Multi-site enablement 
                     o    Burn-in capabilities 

    Test Development Experience 
                     o    CPU, APU, GPU 
                     o    Chipset 
                     o    Digital Audio 
                     o    Baseband 
                     o    Microcontroller 
                     o    LCD Driver 
                     o    Touch Panel Driver 

    ATE platforms and products 


    Reliability Test Standards 


    Design Rule 
    Top Hat Single Piece Lid 


    Lid size=substrate size-0.2mm 

    Standard foot sizes 
                            o    2mm for 15-25mm body 
                            o    3mm for 27-31mm body 
                            o    4mm for 33-50mm body 

    Max 3mm on all four sides (UF will flow under the bend/slant of the HS). Extended design rule allow Max. 2.5mm for the body size ≤31mm 

    Lid is centered 

    Cavity depth for 12inch wafer SPL is 0.8mm and total thickness is 1.3mm 
                            o    TIM Thickness target: 40um (Max. 100um) 
                            o    Adhesive Thickness target: 120um (Max. 200um) 
                            o    Lid manufacturing tolerance: +/-50um 


    Body size<31mm support bare die structure (without stiffener/lid construction) 

    Packing & Shipping (in house standard) 
    BGA / PGA (Tray) 

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