• 產品技術

    封裝品種

    COGCOF Series

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    Production Overview

        TFME is able to provide COG (Chip On Glass) and COF (Chip On Film) services for gold bump drive IC based on customer requirement.  

        


    Process Capability & Design Rule

    COG



    Process Capability & Design Rule

        COF


    Reliability Test Standards
     


    Shipment Packing



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