• 產品技術

    封裝品種

    DIP Series

    DIP400mil

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    Production Overview

    Plastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole PTH technology. It is widely used in low cost and manual applications. NFME offers DIP400mil with lead counts 28&32, the lead pitch is 1.778mm (70mil), that are SDIP type.

     

    Application

    Dual-in-line packages are considered one of the most established industry standard packages. DIP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Design Rule
    Minimum Ink Size: 20l (500) diameter or non-ink with wafer mapping
    Maximum Ink Height: 1mil(25um)
    Minimum Sawing street width: 2.4 (60um)
    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

    Pkg type

    Pkg size

    Wafer thickness

    SDIP

    All

    10~16.8 mil (250~420 um)

     

    Wire Bond Rule

     

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <400um

    38um (1.5mil)

    170 um

    100um

    Max. wire length
    loop height

    5000um
    <400um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <400um

    30 um (1.2mil)

    150um

    90 um

    Max. wire length
    loop height

    5000um
    <400um

    25um (1.0mil)

    70um

    60um

    Max. wire length
    loop height

    5000um
    <400um

    23um (0.9mil)

    60 um

    50um

    Max. wire length
    loop height

    3000um
    <400um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <400um

     

     

    Package Outline

     

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    SDIP

    28

    1.778

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    32

    1.778

    0.46

    0.25

    DOWN

    DOWN

     

    Packing & Shipping(Tube)

     

    SDIP

    PKG TYPE

    Lead count

    QTY/Tube

    Tube/Inner Box

    SDIP

    28

    18

    35

    SDIP

    32

    17

    35

     

     

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