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    封裝品種

    SOP Series

    TSOP

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    Production Overview

    Plastic  Thin Small Outline packaging (TSOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers TSOP with 48 lead counts. The package body is 12* 20mm

     

    Application

    Thin Small Outline packages are considered one of the most established industry standard packages. TSOP is commonly used memory modules, portable electronic products,  cell phones, etc.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Design Rule

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

     

    Maximum Ink Height: 1mil(25um)

     

    Minimum Sawing street width: 2.4mil (80um)

     

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

     

     

     

    Pkg type

    Pkg size

    Wafer thickness

    TSOP

    All

    10~12 mil (250~300 um)

     

    Wire Bond Rule

     

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <200um

    38um (1.5mil)

    170 um

    100um

    Max. wire length
    loop height

    5000um
    <200um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <200um

    30 um (1.2mil)

    150um

    90 um

    Max. wire length
    loop height

    5000um
    <200um

    25um (1.0mil)

    70um

    60um

    Max. wire length
    loop height

    5000um
    <200um

    23um (0.9mil)

    60 um

    50um

    Max. wire length
    loop height

    3000um
    <200um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <200um

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    TSOP

    48

    0.50

    0.20

    0.15

    DOWN

    DOWN

     

    Packing & Shipping

     

    TSOP 48 (Tray)

    PKG TYPE

    Lead count

    QTY/Tray

    Tray/Inner Box

    TSOP

    48

    96

    10+1(Bank)

     

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