• 產品技術

    封裝品種

    SOP Series

    MSOP

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    Production Overview

    Plastic Mini Small Outline packaging (MSOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers Mini SOP with lead counts 8,10 leads. Also,NFME offers the type with Exposed PAD ---HMSOP

     

    Application

    Small Outline packages are considered one of the most established industry standard packages. MSOP is commonly used logic, memory, and micro-controllers.  found in applications such as automotive consumer and communications products.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Design Rule

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

    Maximum Ink Height: 1mil(25um)

    Minimum Sawing street width: 2.4 mil (60um)

     

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

     

    Pkg type

    Pkg size

    Wafer thickness

    Mini SOP

    All

    6.7~8.3 mil (170~210 um)

     

    Wire Bond Rule

     

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <200um

    38um (1.5mil)

    170 um

    100um

    Max. wire length
    loop height

    5000um
    <200um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <200um

    30 um (1.2mil)

    150um

    90 um

    Max. wire length
    loop height

    5000um
    <200um

    25um (1.0mil)

    70um

    60um

    Max. wire length
    loop height

    5000um
    <200um

    23um (0.9mil)

    60 um

    50um

    Max. wire length
    loop height

    3000um
    <200um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <200um

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    MSOP

    8

    0.65

    0.30

    0.15

    DOWN

    DOWN

    MSOP

    10

    0.50

    0.20

    0.15

    DOWN

    DOWN

    HMSOP

    8

    0.65

    0.30

    0.15

    DOWN

    DOWN

    HMSOP

    10

    0.50

    0.20

    0.15

    DOWN

    DOWN

     

    Packing & Shipping

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

     

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