• 產品技術

    封裝品種

    SOP Series

    SOP300mil

    當前位置:首頁 > 產品技術 封裝品種 SOP Series >SOP300mil

     

    Production Overview

    Plastic Small Outline packaging (SOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SOP300mil with lead counts 20,24,28 32,34leads. NFME also offers the type with Heat Sink ---HSOP, that with 28,34 lead counts.

     

    Application

    Small Outline packages are considered one of the most established industry standard packages. SOP is commonly used logic, memory, and micro-controllers.  found in applications such as automotive consumer and communications products.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Design Rule

     

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

    Maximum Ink Height: 1mil(25um)

    Minimum Sawing street width: 2.4mil (60um)

     

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

     

    Pkg type

    Pkg size

    Wafer thickness

    SOP300mil

    All

    10~16.8 mil (250~420 um)


    Wire Bond Rule

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <300um

    38um (1.5mil)

    170 um

    100um

    Max. wire length
    loop height

    5000um
    <300um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <300um

    30 um (1.2mil)

    150um

    90 um

    Max. wire length
    loop height

    5000um
    <300um

    25um (1.0mil)

    70um

    60um

    Max. wire length
    loop height

    5000um
    <300um

    23um (0.9mil)

    60 um

    50um

    Max. wire length
    loop height

    3000um
    <300um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <300um

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    SOP

    20

    1.27

    0.40

    0.25

    DOWN

    DOWN

    SOP

    24

    1.27

    0.40

    0.25

    DOWN

    DOWN

    SOP

    28

    1.27

    0.45

    0.15

    DOWN

    DOWN

    HSOP

    28

    0.80

    0.35

    0.25

    DOWN

    DOWN

    SOP

    32

    1.27

    0.40

    0.20

    DOWN

    DOWN

    HSOP

    34

    0.80

    0.35

    0.25

    DOWN

    DOWN

     

    Packing & Shipping

    SOP300mil (Tube)

    PKG TYPE

    Lead count

    QTY/Tube

    Tube/Inner Box

    SOP

    20

    35

    70

    SOP

    24

    30

    70

    SOP

    28

    25

    70

    HSOP

    28

    25

    70

    SOP

    32

    20

    70

    HSOP

    34

    25

    70


    SOP300mil(Carrier Tape)

     

    PKG TYPE

    Lead count

    Tape Width

    Reel Diameter

    QTY/Reel

    SOP

    20

    24mm

    13"

    1000

    SOP

    28

    24mm

    13"

    1000

    HSOP

    28

    24mm

    13"

    1000

    SOP

    32

    24mm

    13"

    1000

    HSOP

    34

    24mm

    13"

    1000

     

    人妻精品一区二区不卡无码av,人人妻人人狠人人爽天天综合网,人妻熟妇乱又伦精品视频中文字幕