• 產品技術

    封裝品種

    SOP Series

    SOP209mil

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    Production Overview

    Plastic Small Outline packaging (SOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SOP209mil with lead counts 8,14,16 20leads.  The package body width is 5.3/ 5.4mm (209mil).

     

    Application

    Small Outline packages are considered one of the most established industry standard packages. SOP is commonly used logic, memory, and micro-controllers.  found in applications such as automotive consumer and communications products.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Design Rule

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

    Maximum Ink Height: 1mil(25um)

    Minimum Sawing street width: 2.4mil (60um)

     

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

     

    Pkg type

    Pkg size

    Wafer thickness

    SOP209mil

    All

    10~16.8 mil (250~420 um)

     

    Wire Bond Rule

     

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <300um

    38um (1.5mil)

    170 um

    100um

    Max. wire length
    loop height

    5000um
    <300um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <300um

    30 um (1.2mil)

    150um

    90 um

    Max. wire length
    loop height

    5000um
    <300um

    25um (1.0mil)

    70um

    60um

    Max. wire length
    loop height

    5000um
    <300um

    23um (0.9mil)

    60 um

    50um

    Max. wire length
    loop height

    3000um
    <300um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <300um

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    SOP

    8

    Cu

    0.45

    0.15

    DOWN

    DOWN

    SOP(EIAJ)

    8

    Cu

    0.43

    0.20

    DOWN

    DOWN

    SOP

    14

    Alloy 42

    0.45

    0.15

    DOWN

    DOWN

    SOP

    16

    Alloy 42

    0.45

    0.15

    DOWN

    DOWN

    SOP

    20

    Cu

    0.45

    0.15

    DOWN

    DOWN

     

     

    Packing & Shipping

     

    SOP209mil (Tube)

    PKG TYPE

    Lead count

    QTY/Tube

    Tube/Inner Box

    SOP

    8

    80

    80

    SOP(EIAJ)

    8

    95

    100

    SOP

    14

    50

    80

    SOP

    16

    50

    80

    SOP

    20

    40

    80

     

     

    SOP209mil(Carrier Tape)

     

    PKG TYPE

    Lead count

    Tape Width

    Reel  Diameter

    QTY/Reel

    SOP

    8

    16mm

       13"

    1500

    SOP(EIAJ)

    8

    16mm

       13"

    2000

    SOP

    14

    16mm

    13"

    1500

    SOP

    16

    16mm

    13"

    1500

    SOP

    20

    16mm

    13"

    1500

     

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