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    封裝品種

    DIP Series

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    Production Overview

    Plastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole PTH technology. It is widely used in low cost and manual applications. NFME offers DIP750mil with 64lead counts the lead pitch is 1.778mm ,that is SDIP and 88 lead counts (the lead pitch is 1.27mm ,that is SSDIP).

     

    Application

    Dual-in-line packages are considered one of the most established industry standard packages. DIP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Design Rule

     

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

    Minimum Sawing street width: 2.4 mil (60um)

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

     

    Pkg type

    Pkg size

    Wafer thickness

    SDIP/SSDIP

    All

    10~16.8mil (250~420 um)

     

    Wire Bond Rule

     

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <400um

    38um (1.5mil)

    170 um

    100 um

    Max. wire length
    loop height

    5000um
    <400um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <400um

    30 um (1.2mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <400um

    25um (1.0mil)

    70 um

    60 um

    Max. wire length
    loop height

    5000um
    <400um

    23um (0.9mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <400um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <400um

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    SDIP

    64

    1.778

    0.46

    0.25

    DOWN

    DOWN

    SSDIP

    88

    1.27

    0.46

    0.25

    DOWN

    DOWN

    DIP

    24

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP

    28

    2.54

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    42

    1.778

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    48

    1.778

    0.46

    0.25

    DOWN

    DOWN

    DIP

    7

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP7-M(P7)

    7

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP

    8

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP8-M

    8

    2.54

    0.46

    0.25

    DOWN

    DOWN

    HDIP

    12

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP

    14

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIPT

    14

    2.54

    0.50

    0.30

    DOWN

    DOWN

    DIP

    16

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP16-M

    16

    2.54

    0.46

    0.25

    DOWN

    DOWN

    HDIP

    16

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP

    18

    2.54

    0.46

    0.25

    DOWN

    DOWN

    DIP

    20

    2.54

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    24

    1.778

    0.43

    0.25

    DOWN

    DOWN

    SKDIP

    24

    2.54

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    52

    1.778

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    28

    1.778

    0.46

    0.25

    DOWN

    DOWN

    SDIP

    32

    1.778

    0.46

    0.25

    DOWN

    DOWN

     

    Packing & Shipping(Tube)

     

    SDIP/SSDIP

    PKG TYPE

    Lead count

    QTY/Tube

    Tube/Inner Box

    SDIP

    64

    8

    15

    SSDIP

    88

    8

    15

     

     

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