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    TO Series

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    Production Overview

    Plastic  Transistor Outline packaging (TO) is a principal package using TH or SMD technology. It is widely used in low cost and manual applications. NFME offers TO92,TO251(IPAK), TO252(DPAK), TO263(DDPAK), TO220 ,TO247 packages.

     

    Application

    Transistor Outline packages are considered one of the most established industry standard packages. TO is commonly used power supplies, converters and power motor controls, Hand-held Instruments battery powered consumer products,etc.  

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

     

    Reliability Test Standards

    The test criterion is zero defect out of 77 sampling units.

    JEDEC Precondition J-STD-20/JESD22-A113

     

    Temp/Humidity Test

    85°C/ 85% RH, JEDEC 22- A101

    Pressure Cooker Test

    121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102

    Temp Cycle Test

    -65 ~ 150°C, JEDEC22-A104

    High Temp Storage Test

    150°C, JEDEC 22- A103

    High Accelerated Stress Test

    130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118

     

    Design Rule

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

    Maximum Ink Height: 1mil(25um)

    Minimum Sawing street width: 2.4mil (60um)

     

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

     

    Pkg type

    Pkg size

    Wafer thickness

    TO

    All

    11~13.4 mil (280~340 um)

    If that is asked to use soft solder for the die attachment, the wafer can not be backgrinding.

     

    Wire Bond Rule

    Au Wire

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <400um

    38um (1.5mil)

    170 um

    100 um

    Max. wire length
    loop height

    5000um
    <400um

    33um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <400um

    30um (1.2mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <400um

    25um (1.0mil)

    70 um

    60 um

    Max. wire length
    loop height

    5000um
    <400um

    23um (0.9mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <400um

    20um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <400um

     

    Al Wire

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire distance

     

    3 mil

    330 um

    305*295 um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    4mil

    420 um

    390*310um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    5mil

    560 um

    490*430 um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    7mil

    630 um

    690*460um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    8mil

    650 um

    780*510um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    10mil

    690 um

    900*510um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    12mil

    770 um

    1080*620um

    Min Wire distance
    Min Wire slope

    3000um
    <400um

    14mil

    890 um

    1150*700um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    15mil

    960 um

    1230*770um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    18mil

    1120 um

    1360*900um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    20mil

    1280 um

    1440*1000um

    Min Wire distance
    Min Wire slope

    200um
    0.4

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    TO92

    3

    1.27

    0.46

    0.38

    DOWN

    DOWN

    TO251

    3

    2.28

    0.81

    0.51

    DOWN

    DOWN

    TO251

    3

    2.25

    0.70

    0.50

    DOWN

    DOWN

    TO252

    2/3

    2.29

    0.81

    0.51

    DOWN

    DOWN

    TO252-M

    2

    2.286

    0.76

    0.51

    DOWN

    DOWN

    TO252

    4

    1.30

    0.50

    0.51

    DOWN

    DOWN

    TO252

    4

    1.14

    0.61

    0.51

    DOWN

    DOWN

    TO262

    2/3

    2.54

    0.81

    0.38

    DOWN

    DOWN

    TO263

    2/3

    2.54

    0.81

    0.38

    DOWN

    DOWN

    TO263

    5

    1.70

    0.81

    0.38

    DOWN

    DOWN

    TO263

    7

    1.27

    0.60

    0.38

    DOWN

    DOWN

    TO220(P1)

    2

    5.08

    0.81

    0.38

    DOWN

    DOWN

    TO220(P2)

    2

    5.08

    0.81

    0.38

    DOWN

    DOWN

    TO220

    3

    2.54

    0.81

    0.38

    DOWN

    DOWN

    TO220(FP)

    3

    2.54

    0.80

    0.50

    DOWN

    DOWN

    TO220

    5

    3.40/1.70

    0.79

    0.38

    DOWN

    DOWN

    TO220(Straight)

    5

    1.70

    0.79

    0.38

    DOWN

    DOWN

    TO220(Straight)

    5

    1.70

    0.81

    0.38

    DOWN

    DOWN

    TO220

    7

    1.27

    0.65

    0.38

    DOWN

    DOWN

    TO247

    3

    5.44

    1.20

    0.60

    DOWN

    DOWN

     

     

    Packing & Shipping

    Bag

    PKG TYPE

    Lead count

    QTY/Bag

    Bag/inner Box

    TO92

    3

    1000

    10

     

    Tube

    PKG TYPE

    Lead count

    QTY/Tube

    Tube/Inner Box

    TO251

    3

    70

    50

    TO252

    2/3/4

    70

    50

    TO262

    2 /3

    50

    25

    TO263

    2/3/5

    50

    25

    TO220

    2/3/5/7

    50

    20

    TO247

    3

    30

    8

     

    Carrier Tape

    PKG TYPE

    Lead count

    Tape Width

     Reel Diameter

    QTY/Reel

    TO252

    2/3/4

    16mm

    13"

    2500

    TO262

    2/3

    24mm

    13"

    800

    TO263

    2/3/5

    24mm

    13"

    800

    TO92

    3

    18mm

    15"                 

    2000

     

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