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    SOT Series

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    Production Overview

    Plastic  Small Outline Transistor  packaging (SOT) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SOT23 ,SC70,SOT89,SOT223 packages.

     

    Application

    Small Outline Transistor packages are considered one of the most established industry standard packages. SOT is commonly used in wireless/RF and analog devices, portable products such as cell phones, data storage systems, notebook computers and pagers.

     

    Features

    * JEDEC standard compliant or reference
    * Wide choice of pad sizes to meet die size per customer lead frame design capability
    * Pb-free process ready and Green Molding Compound

    (1mm=39.37mil; 1mil=25.4um)

     

    Reliability Test Standards

    The test criterion is zero defect out of 77 sampling units.

    JEDEC Precondition J-STD-20/JESD22-A113

    Temp/Humidity Test

    85°C/ 85% RH, JEDEC 22- A101

    Pressure Cooker Test

    121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102

    Temp Cycle Test

    -65 ~ 150°C, JEDEC22-A104

    High Temp Storage Test

    150°C, JEDEC 22- A103

    High Accelerated Stress Test

    130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118

     

    Design Rule

    Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

     Maximum Ink Height: 1mil(25um)

    Minimum Sawing street width: 2.4mil (60um)

    Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

    Pkg type

    Pkg size

    Wafer thickness

    SOT

    SOT23

    9.5~11mil (240~280 um)

    SOT

    SC70

    6.7~8.3 mil (170~210 um)

    SOT

    SOT223

    9.5~13.4 mil (240~340 um)

    SOT

    SOT89

    9.5~13.4mil (240~340 um)

     

    Wire Bond Rule

    Wire size

    Min. bond pad pitch

    Min. bond pad opening

    Wire loop control

     

    50um (2.0mil)

    200 um

    150 um

    Max. wire length
    loop height

    5000um
    <300um

    38um (1.5mil)

    170 um

    100um

    Max. wire length
    loop height

    5000um
    <300um

    33 um (1.3mil)

    150 um

    90 um

    Max. wire length
    loop height

    5000um
    <300um

    30 um (1.2mil)

    150um

    90 um

    Max. wire length
    loop height

    5000um
    <300um

    25um (1.0mil)

    70um

    60um

    Max. wire length
    loop height

    5000um
    <300um

    23um (0.9mil)

    60 um

    50um

    Max. wire length
    loop height

    3000um
    <300um

    20 um (0.8mil)

    60 um

    50 um

    Max. wire length
    loop height

    3000um
    <300um

    Package Outline

     

    DIP/SkDIP/SDIP/HDIP (All units are in mm)

    PKG TYPE

    Lead count

    Lead Pitch

    Lead Width

    LeadThickness

    BD

    POD

    SOT23

    3

    0.95

    0.38

    0.15

    DOWN

    DOWN

    SOT23

    5

    0.95

    0.38

    0.15

    DOWN

    DOWN

    TSOT23

    5

    0.95

    0.38

    0.15

    DOWN

    DOWN

    SOT23

    6

    0.95

    0.38

    0.15

    DOWN

    DOWN

    TSOT23

    6

    0.95

    0.38

    0.15

    DOWN

    DOWN

    SOT24

    4

    1.90

    0.40

    0.10

    DOWN

    DOWN

    SC70

    5

    0.65

    0.25

    0.13

    DOWN

    DOWN

    SC70

    6

    0.65

    0.25

    0.13

    DOWN

    DOWN

    SOT89

    4

    1.50

    0.40

    0.40

    DOWN

    DOWN

    SOT223

    4

    2.30

    0.71

    0.30

    DOWN

    DOWN

     

    Packing & Shipping(Carrier Tape)

     

    PKG TYPE

    Lead count

    Tape Width

    Reel Diameter

    QTY/Reel

    SOT23

    3

    8mm

    7"

    3000

    SOT23

    5

    8mm

    7"

    3000

    SOT23

    6

    8mm

    7"

    3000

    SC70

    5

    8mm

    7"

    3000

    SC70

    6

    8mm

    7"

    3000

    SOT89

    4

    12mm

    7"/13"

    1000/2500

    SOT223

    4

    12mm

    7"/13"

    1000/2500

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